Last month, IMEC - a world leading independent research center in nanoelectronics and nanotechnology - unveiled a new 3D integration process enabling flexible electronic systems with a thickness of less than 60 micrometer at Smart Systems Integration Conference in Brussels (Belgium). This ultra thin chip package technology allows integrating complete systems in a conventional low cost flex substrate. This will enable low cost, unobtrusive wearable electronics like wearable health and comfort monitoring and more. Read the rest of this article »